| AC10-001 - Assembly considerations for AC3030 and AC3050 Pressure Die |
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This application note outlines some considerations in regards to die-picking from wafer rings and die-attach. AC10-001 |
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| AC10-002 - Position (g) sensitivity of AC3050 Pressure Die |
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This application note describes tests done on the AC3050 die to determine the effecton position/orientation on the sensor's output. AC10-002 |
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| AC10-003 - Zero Stability of the AC3050 Pressure Die |
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This application note present test data on zero stability for sample builts of the AC3050 die. AC10-003 |
